Die Bonding and Vacuum Packaging System

Estimated Value: $350,000
Archived Washington DCGeneral / Otherrfp
This bid is closed — responses were due August 7, 2026. It is no longer accepting submissions. We keep closed bids on BidsNexus for reference: agencies often re-issue the same need, and past bids show what they buy and when.
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Aug 3, 2026
Aug 7, 2026 7:00 PM
General / Other
rfp
333993
AI Summary
This bid is for the procurement of a Die Bonding and Vacuum Packaging System, likely for use in manufacturing or research within the general industry sector.
Line Items
ItemQtyUnitEst. Unit PriceEst. TotalCategory
Die Bonding and Vacuum Packaging System 1 each $350,000.00 $350,000.00 Other
Estimated Bid Value$350,000.00

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📎 Q_and_A_-_CSS_N0017326QKN05.pdf View
📎 Specifications_-_Die_Bonding.pdf View
📎 CSS_N0017326QKN05_Die_Bonding_and_Packaging.pdf View
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