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Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.
This bid is closed — responses were due August 12, 2026.
It is no longer accepting submissions. We keep closed bids on BidsNexus for reference: agencies often re-issue the same need, and past bids show what they buy and when.
This bid is for a specialized photonic integrated circuit packaging service for eight PICs, which includes wire bonding, fiber alignment, and bonding of fiber array units, along with the necessary process development and engineering.
Line Items
Item
Qty
Unit
Est. Unit Price
Est. Total
Category
Photonic Integrated Circuit (PIC) Packaging Service (per PIC)
8
each
$10,000.00
$80,000.00
IT Services
Wire Bonding to PCB (per PIC)
8
each
$1,000.00
$8,000.00
IT Services
Fiber Alignment and Bonding of Fiber Array Units (FAUs) (per PIC)
8
each
$2,000.00
$16,000.00
IT Services
Process Development and Engineering Costs (associated with packaging 8 PICs)
1
lot
$16,000.00
$16,000.00
Professional Services
Estimated Bid Value
$120,000.00
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